TeFill Chip Repair

The TeFill Chip Repair is a dual-viscosity stone repair system designed to quickly and effectively repair blemishes on natural and engineered stone surfaces. With fast-bonding adhesives and an easy-to-use activator, TeFill delivers seamless, professional-grade repairs in minutes.

Key Benefits

• Fast-drying formula bonds in seconds
• Creates polished, seamless repairs
• Suitable for both horizontal and vertical surfaces
• Dual-viscosity system for different repair need
• Professional-grade results in minutes

Suitable Applications

Fissures, Scratches, Chips, Surface Breaks.

Kit Components

TeFill 1
A low-viscosity adhesive designed for repairing fissures, scratches, and minor chips on horizontal surfaces. It flows easily into small openings, dries in seconds when activated, and can be finished with a razor blade for a smooth, polished appearance.

TeFill 2
A thicker adhesive intended for larger chips and edge repairs. Ideal for vertical surfaces, it offers excellent hold without running, making it suitable for more demanding repair applications.

TeFill 3
The activator used with TeFill 1 and TeFill 2 to trigger rapid bonding. It allows precise placement of the adhesive before initiating the quick-drying process, creating strong and durable repairs in seconds.

Directions for Use

1. Clean and dry the damaged area thoroughly before beginning the repair.
2. Apply TeFill 1 to fissures, scratches, and minor chips on horizontal surfaces.
3. Apply TeFill 2 to larger chips, edge repairs, or vertical surfaces where a thicker adhesive is needed.
4. Once positioned, use TeFill 3 activator to cure the adhesive.
5. Allow the repair to bond and dry in seconds.
6. Finish the repaired area with a razor blade or appropriate finishing method for a smooth, polished result.